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WÜRTH ELEKTRONIK - ELECTROMECHANICAL COMPONENTS - BTB-Board To Board - Socket Header - 2.00 mm - 2 Row

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WÜRTH ELEKTRONIK
ConPSHD Dual SMT Socket Header _2,00 (mm)

Document(s) for this product

Dimensional drawing
Product Data Sheet
 
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621304242921 ConPSHD Dual SMT Socket Header _2,00 (mm)
 Part Number  Description  Insulator Material  Insulator Colour  Contact Material  Contact Plating  Contact Type  Standard Polarities  Pitch  Quality Class  Operating Temperature  Insulator Flammability Rating  Rated Current UL (A)  Working Voltage UL (VAC)  Withstanding Voltage UL (KVAC/min)  Contact Resistance UL (mOHM)  Insulation Resistance  UL  Compliance  Solder Profile  Packaging
621304242921
ConPSHD Dual SMT Socket Header _2,00 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24;44
2.00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0.5
20
>1000 (MΩ)
E323964
Lead free / RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Cap
621306242921
ConPSHD Dual SMT Socket Header _2,00 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24;44
2.00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0.5
20
>1000 (MΩ)
E323964
Lead free / RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
621308242921
ConPSHD Dual SMT Socket Header _2,00 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24;44
2.00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0.5
20
>1000 (MΩ)
E323964
Lead free / RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
621310242921
ConPSHD Dual SMT Socket Header _2,00 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24;44
2.00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0.5
20
>1000 (MΩ)
E323964
Lead free / RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
621314242921
ConPSHD Dual SMT Socket Header _2,00 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24;44
2.00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0.5
20
>1000 (MΩ)
E323964
Lead free / RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
621316242921
ConPSHD Dual SMT Socket Header _2,00 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24;44
2.00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0.5
20
>1000 (MΩ)
E323964
Lead free / RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
621320242921
ConPSHD Dual SMT Socket Header _2,00 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24;44
2.00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0.5
20
>1000 (MΩ)
E323964
Lead free / RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
621324242921
ConPSHD Dual SMT Socket Header _2,00 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24;44
2.00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0.5
20
>1000 (MΩ)
E323964
Lead free / RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
621344242921
ConPSHD Dual SMT Socket Header _2,00 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24;44
2.00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0.5
20
>1000 (MΩ)
E323964
Lead free / RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad

Bill of Materials Data

Manufacturer WÜRTH ELEKTRONIK
Description ConPSHD Dual SMT Socket Header _2,00 (mm)
Part Number 621304242921
Insulator Material PA6T
Insulator Colour Black
Contact Material Copper Alloy
Contact Plating Gold
Contact Type Stamped
Standard Polarities 04;06;08;10;14;16;20;24;44
Pitch 2.00 (mm)
Quality Class 3 as per CECC 75 301-802
Operating Temperature -40 °C up to +125 °C
Insulator Flammability Rating UL94-V0
Rated Current UL (A) 2
Working Voltage UL (VAC) 250
Withstanding Voltage UL (KVAC/min) 0.5
Contact Resistance UL (mOHM) 20
Insulation Resistance >1000 (MΩ)
UL E323964
Compliance Lead free / RoHS
Solder Profile JEDEC lead free reflow soldering process
Packaging Tape and Reel with Cap
Orientation Straight
Gender Female

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