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WÜRTH ELEKTRONIK - ELECTROMECHANICAL COMPONENTS - BTB-Board To Board - Socket Header - 2.00 mm - 2 Row

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WÜRTH ELEKTRONIK
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm) Dimensional drawing 2D

Document(s) for this product

Product Data Sheet
 
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62100421821 ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
 Part Number  Description  Insulator Material  Insulator Colour  Contact Material  Contact Plating  Contact Type  Standard Polarities  Pitch  Quality Class  Operating Temperature  Insulator Flammability Rating  Rated Current (A)  Rated Current VDE (A)  Withstanding Voltage (KVAC/min)  Contact Resistance (mOHM)  Insulation Resistance  Compliance  Solder Profile  Packaging
62100421821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tube
62100621821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tube
62100821821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tube
62101021821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tube
62101421821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tube
62101621821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tube
62102021821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tube
62102421821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tube

Bill of Materials Data

Manufacturer WÜRTH ELEKTRONIK
Description ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
Part Number 62100421821
Insulator Material LCP
Insulator Colour Black
Contact Material Copper Alloy
Contact Plating Gold
Contact Type Stamped
Standard Polarities 04;06;08;10;14;16;20;24
Pitch 2,00 (mm)
Quality Class 3 as per CECC 75 301-802
Operating Temperature -40 °C up to +125 °C
Insulator Flammability Rating UL94-V0
Rated Current (A) 2
Rated Current VDE (A) 250
Withstanding Voltage (KVAC/min) 0,5
Contact Resistance (mOHM) 20
Insulation Resistance >1000 (MΩ)
Compliance RoHS
Solder Profile JEDEC lead free reflow soldering process
Packaging Tube
Orientation Straight
Gender Socket Header

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