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EXAIR’s New Catalog 28 Offers 192 Pages of Intelligent Compressed Air® Solutions

EXAIR’s new Catalog 28 is our best catalog yet; a full color technical guide offering solutions to common industrial cooling, drying, conveying, blowoff, cleaning, coating and static electricity problems. This 192 page catalog includes many new products that can help companies conserve compressed air, reduce dangerous noise levels and eliminate harmful dead end pressures. Featured

07 July 2015
J.W. Winco, Inc. Leveling Sets Offer Precise Leveling and Locking

J.W. Winco, Inc., a supplier of standard industrial machine components, announced it now offers GN 350.5 and GN 350.5-NI Steel and Stainless Steel Leveling Sets, with Spherical Washer, with Locknut, in metric sizes. These RoHS-compliant leveling sets are used for leveling, adjusting, and linking operations. GN 350.5 versions are made of zinc plated, blue passivated

06 July 2015
New Large Internal Mix Spray Nozzles Coat, Cool, Treat and Paint

EXAIR’s new 1/2 NPT internal mix atomizing spray nozzles atomize fluids in a range of spray patterns and liquid volumes for a variety of uses. They combine liquid and compressed air inside of the air cap to produce the finest mist of atomized liquid that can be easily adjusted to meet the needs of your

05 July 2015
Durex Industries SENTINEL® Molded Foam Silicone Rubber Heater

Durex Industries recently announced the product introduction of the SENTINEL® Molded Foam Silicone Rubber Heater. In semiconductor equipment applications Durex Industries’ SENTINEL heaters offer the advances of improved thermal efficiency, higher process temperatures, and reduced system cost. Durex Industries developed this patent-pending advanced heater technology, because Semiconductor Equipment Industry engineers need thermal solutions that meet

30 June 2015
Low thermal expansion epoxy from epoxySet

epoxySet announces the release of the EB-315, low thermal expansion epoxy, to the line of low expansion/ thermally conductive products. This versatile material can be used as an adhesive or encapsulant for semi-conductors and other microelectronics, a gasket sealing compound, wire bonder or any application where temperature cycling between -55°C and 230°C is required. The

30 June 2015