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WÜRTH ELEKTRONIK - ELECTROMECHANICAL COMPONENTS - BTB-Board To Board - Socket Header - 1.27 mm - 2 Row

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WÜRTH ELEKTRONIK
ConPSHD Dual SMT Socket Header Bottom Entry _1,27 (mm)
ConPSHD Dual SMT Socket Header Bottom Entry _1,27 (mm) Dimensional drawing 2D

Document(s) for this product

Product Data Sheet
 
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623310235321 ConPSHD Dual SMT Socket Header Bottom Entry _1,27 (mm)
Part Number Description Insulator Material Insulator Colour Contact Material Contact Plating Contact Type Standard Polarities Pitch Quality Class Operating Temperature Insulator Flammability Rating Rated Current (A) Working Voltage (VAC) Withstanding Voltage (KVAC/min) Contact Resistance (mOHM) Insulation Resistance Compliance Solder Profile Packaging
623310235321
ConPSHD Dual SMT Socket Header Bottom Entry _1,27 (mm)
PA9T
Black
Copper Alloy
Gold
Stamped
10;26;50
1,27 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
1
50
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
623326235321
ConPSHD Dual SMT Socket Header Bottom Entry _1,27 (mm)
PA9T
Black
Copper Alloy
Gold
Stamped
10;26;50
1,27 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
1
50
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
623350235321
ConPSHD Dual SMT Socket Header Bottom Entry _1,27 (mm)
PA9T
Black
Copper Alloy
Gold
Stamped
10;26;50
1,27 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
1
50
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad

Bill of Materials Data

Manufacturer WÜRTH ELEKTRONIK
Description ConPSHD Dual SMT Socket Header Bottom Entry _1,27 (mm)
Part Number 623310235321
Insulator Material PA9T
Insulator Colour Black
Contact Material Copper Alloy
Contact Plating Gold
Contact Type Stamped
Standard Polarities 10;26;50
Pitch 1,27 (mm)
Quality Class 3 as per CECC 75 301-802
Operating Temperature -40 °C up to +125 °C
Insulator Flammability Rating UL94-V0
Rated Current (A) 1
Working Voltage (VAC) 50
Withstanding Voltage (KVAC/min) 0,5
Contact Resistance (mOHM) 20
Insulation Resistance >1000 (MΩ)
Compliance RoHS
Solder Profile JEDEC lead free reflow soldering process
Packaging Tape and Reel with Pad
Orientation Straight
Gender Socket Header

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