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WÜRTH ELEKTRONIK - ELECTROMECHANICAL COMPONENTS - BTB-Board To Board - Socket Header - 2.54 mm - 1 Row - SMT

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WÜRTH ELEKTRONIK
ConPSHD SMT Socket Header Bottom Entry _2,54 (mm)
ConPSHD SMT Socket Header Bottom Entry _2,54 (mm) Dimensional drawing 2D

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Product Data Sheet
 
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610304243021 ConPSHD SMT Socket Header Bottom Entry _2,54 (mm)
 Part Number  Description  Insulator Material  Insulator Colour  Contact Material  Contact Plating  Contact Type  Standard Polarities  Pitch  Quality Class  Operating Temperature  Insulator Flammability Rating  Rated Current (A)  Working Voltage (VAC)  Withstanding Voltage (KVAC/min)  Contact Resistance (mOHM)  Insulation Resistance  Compliance  Solder Profile  Packaging
610304243021
ConPSHD SMT Socket Header Bottom Entry _2,54 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;12;16;18;20
2,54 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
3
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
610306243021
ConPSHD SMT Socket Header Bottom Entry _2,54 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;12;16;18;20
2,54 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
3
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
610308243021
ConPSHD SMT Socket Header Bottom Entry _2,54 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;12;16;18;20
2,54 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
3
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
610310243021
ConPSHD SMT Socket Header Bottom Entry _2,54 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;12;16;18;20
2,54 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
3
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
610312243021
ConPSHD SMT Socket Header Bottom Entry _2,54 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;12;16;18;20
2,54 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
3
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
610316243021
ConPSHD SMT Socket Header Bottom Entry _2,54 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;12;16;18;20
2,54 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
3
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
610318243021
ConPSHD SMT Socket Header Bottom Entry _2,54 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;12;16;18;20
2,54 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
3
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
610320243021
ConPSHD SMT Socket Header Bottom Entry _2,54 (mm)
PA6T
Black
Copper Alloy
Gold
Stamped
04;06;08;10;12;16;18;20
2,54 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
3
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad

Bill of Materials Data

Manufacturer WÜRTH ELEKTRONIK
Description ConPSHD SMT Socket Header Bottom Entry _2,54 (mm)
Part Number 610304243021
Insulator Material PA6T
Insulator Colour Black
Contact Material Copper Alloy
Contact Plating Gold
Contact Type Stamped
Standard Polarities 04;06;08;10;12;16;18;20
Pitch 2,54 (mm)
Quality Class 3 as per CECC 75 301-802
Operating Temperature -40 °C up to +125 °C
Insulator Flammability Rating UL94-V0
Rated Current (A) 3
Working Voltage (VAC) 250
Withstanding Voltage (KVAC/min) 0,5
Contact Resistance (mOHM) 20
Insulation Resistance >1000 (MΩ)
Compliance RoHS
Solder Profile JEDEC lead free reflow soldering process
Packaging Tape and Reel with Pad
Orientation Straight
Gender Socket Header

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