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WÜRTH ELEKTRONIK - ELECTROMECHANICAL COMPONENTS - DC-Power Jacks - SMT

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WÜRTH ELEKTRONIK
ConDCPJ DC Power Jack Right Angled Low Profile SMT Opening Diameter Ø3.9 mm with 4 Soldering Pads and Pegs
ConDCPJ DC Power Jack Right Angled Low Profile SMT Opening Diameter Ø3.9 mm with 4 Soldering Pads and Pegs Dimensional drawing 2D

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Product Data Sheet
 
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694102107102 ConDCPJ DC Power Jack Right Angled Low Profile SMT Opening Diameter Ø3.9 mm with 4 Soldering Pads and Pegs
Part Number Description Insulator Material Insulator Colour Contact Material Contact Type Center Pin Plating Center Pin Terminal Plating Tip Spring Plating Shunt Terminal Plating Standard Polarities Quality Class Operating Temperature Rated Current (A) Working Voltage (VAC) Withstanding Voltage (KVAC/min) Contact Resistance (mOHM) Insulation Resistance Compliance Solder Profile Packaging
694102107102
ConDCPJ DC Power Jack Right Angled Low Profile SMT Opening Diameter Ø3.9 mm with 4 Soldering Pads and Pegs
PA9T
Black
Copper Alloy
Stamped
Gold
Tin
Tin
Tin
1,0;1,3
5 000 Mating cycles
-40 °C up to +85 °C
5
18
0,5
50
>100 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tray
694103107102
ConDCPJ DC Power Jack Right Angled Low Profile SMT Opening Diameter Ø3.9 mm with 4 Soldering Pads and Pegs
PA9T
Black
Copper Alloy
Stamped
Gold
Tin
Tin
Tin
1,0;1,3
5 000 Mating cycles
-40 °C up to +85 °C
5
18
0,5
50
>100 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tray

Bill of Materials Data

Manufacturer WÜRTH ELEKTRONIK
Description ConDCPJ DC Power Jack Right Angled Low Profile SMT Opening Diameter Ø3.9 mm with 4 Soldering Pads and Pegs
Part Number 694102107102
Insulator Material PA9T
Insulator Colour Black
Contact Material Copper Alloy
Contact Type Stamped
Center Pin Plating Gold
Center Pin Terminal Plating Tin
Tip Spring Plating Tin
Shunt Terminal Plating Tin
Standard Polarities 1,0;1,3
Quality Class 5 000 Mating cycles
Operating Temperature -40 °C up to +85 °C
Rated Current (A) 5
Working Voltage (VAC) 18
Withstanding Voltage (KVAC/min) 0,5
Contact Resistance (mOHM) 50
Insulation Resistance >100 (MΩ)
Compliance RoHS
Solder Profile JEDEC lead free reflow soldering process
Packaging Tray
Type Low Profile
Orientation Right Angled
Option Pads and Pegs
Construction SMT
Diameter (Ø) 3,9

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