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WÜRTH ELEKTRONIK - ELECTROMECHANICAL COMPONENTS - BTB-Board To Board - Socket Header - 2.00 mm - 2 Row

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WÜRTH ELEKTRONIK
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm) Dimensional drawing 2D

Document(s) for this product

Product Data Sheet
 
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62130421821 ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
 Part Number  Description  Insulator Material  Insulator Colour  Contact Material  Contact Plating  Contact Type  Standard Polarities  Pitch  Quality Class  Operating Temperature  Insulator Flammability Rating  Rated Current (A)  Working Voltage (VAC)  Withstanding Voltage (KVAC/min)  Contact Resistance (mOHM)  Insulation Resistance  Compliance  Solder Profile  Packaging
62130421821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
62130621821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
62130821821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
62131021821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
62131421821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
62131621821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
62132021821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad
62132421821
ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
LCP
Black
Copper Alloy
Gold
Stamped
04;06;08;10;14;16;20;24
2,00 (mm)
3 as per CECC 75 301-802
-40 °C up to +125 °C
UL94-V0
2
250
0,5
20
>1000 (MΩ)
RoHS
JEDEC lead free reflow soldering process
Tape and Reel with Pad

Bill of Materials Data

Manufacturer WÜRTH ELEKTRONIK
Description ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
Part Number 62130421821
Insulator Material LCP
Insulator Colour Black
Contact Material Copper Alloy
Contact Plating Gold
Contact Type Stamped
Standard Polarities 04;06;08;10;14;16;20;24
Pitch 2,00 (mm)
Quality Class 3 as per CECC 75 301-802
Operating Temperature -40 °C up to +125 °C
Insulator Flammability Rating UL94-V0
Rated Current (A) 2
Working Voltage (VAC) 250
Withstanding Voltage (KVAC/min) 0,5
Contact Resistance (mOHM) 20
Insulation Resistance >1000 (MΩ)
Compliance RoHS
Solder Profile JEDEC lead free reflow soldering process
Packaging Tape and Reel with Pad
Orientation Straight
Gender Socket Header

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